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【やじうまPC Watch】AMDがISSCC 2023でZen 4のI/Oダイ画像を共有

Zen 4 Raphael 6 nm client I/O die: – 128b DDR5 PHY + 32b for ECC (8b per 32b channel) – 2x GMI3 Ports, 3x CCDs are not possible. :p – 28x PCIe 5, Zen1/2/3 cIOD had 32x PCIe lanes. So AMD reduced the waste for the client market. – Really just one RDNA2 WGP, 128 Shader “Cores”https://t.co/bkqdVvhgrnpic.twitter.com/erYxTw1p8h

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